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US Patent 11745424 Building material enclosure comprising a thermal break

Patent 11745424 was granted and assigned to Formlabs on September, 2023 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Formlabs
Formlabs
Date Filed
September 16, 2020
Date of Patent
September 5, 2023
Patent Applicant
Formlabs
Formlabs
Patent Application Number
17022401
Patent Citations
‌
US Patent 10363603 Method for producing a component and an apparatus for working the method
Patent Inventor Names
Christopher Auld
Luke Plummer
Robb Morgan
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11745424
Patent Primary Examiner
‌
Leith S Shafi
CPC Code
‌
B29C 64/25
‌
B22F 12/38
‌
B29C 64/153
‌
B29C 64/295
‌
B29C 64/255

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