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US Patent 11477904 Electronic assembly including cable modules

Patent 11477904 was granted and assigned to TE Connectivity on October, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
TE Connectivity
TE Connectivity
Current Assignee
TE Connectivity
TE Connectivity
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11477904
Date of Patent
October 18, 2022
Patent Application Number
17168413
Date Filed
February 5, 2021
Patent Citations
‌
US Patent 10218098 Module mount interposer
‌
US Patent 10756296 Packaging structure
Patent Citations Received
‌
US Patent 12089357 Electronic assembly including cable modules
0
Patent Primary Examiner
‌
Alexander Gilman
CPC Code
‌
H05K 7/1084
‌
H01R 12/714
‌
H05K 7/1069
‌
H01R 12/7076

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

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