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US Patent 11449111 Scalable, high load, low stiffness, and small footprint loading mechanism

Patent 11449111 was granted and assigned to Intel on September, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Intel
Intel
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Current Assignee
Intel
Intel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114491110
Date of Patent
September 20, 2022
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Patent Application Number
159422800
Date Filed
March 30, 2018
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Patent Citations
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US Patent 10030685 Polygonal driving means with inbuilt collar
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US Patent 10455685 Electronic device, socket, and spacer to alter socket profile
Patent Citations Received
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US Patent 11852186 Dial cam latch
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Patent Primary Examiner
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Abhishek M Rathod
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CPC Code
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H05K 7/16
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G06F 1/183
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H05K 7/183
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H05K 7/1007
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H05K 7/1422
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A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

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