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US Patent 11387163 Scalable debris-free socket loading mechanism

Patent 11387163 was granted and assigned to Intel on July, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
113871630
Patent Inventor Names
Andrew Larson0
Bijoyraj Sahu0
Craig J. Jahne0
Eric W. Buddrius0
Ralph V. Miele0
Date of Patent
July 12, 2022
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Patent Application Number
159422780
Date Filed
March 30, 2018
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Patent Citations
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US Patent 10455685 Electronic device, socket, and spacer to alter socket profile
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US Patent 10030685 Polygonal driving means with inbuilt collar
Patent Primary Examiner
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Flemming Saether
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CPC Code
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F16B 33/006
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F16B 37/145
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F16B 37/14
0

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

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