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US Patent 11359047 Epoxy resin systems

Patent 11359047 was granted and assigned to Hexion Inc. on June, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
Hexion Inc.
Current Assignee
‌
Hexion Inc.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11359047
Patent Inventor Names
Alla Hale0
Amitabh Bansal0
Diana Sepulveda-Camarena0
Jennifer W. Chung0
Larry Steven Corley0
Leeanne Taylor0
Date of Patent
June 14, 2022
Patent Application Number
16126612
Date Filed
September 10, 2018
Patent Primary Examiner
‌
David T Karst
CPC Code
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C08G 59/4071
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C08G 59/5073
‌
C08G 59/56
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C08G 59/686
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C08G 59/3245
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C08G 59/36

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

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