Log in
Enquire now
‌

US Patent 11326242 Copper-nickel-tin alloys

Patent 11326242 was granted and assigned to Materion (company) on May, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Materion (company)
Materion (company)
0
Current Assignee
Materion (company)
Materion (company)
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
113262420
Patent Inventor Names
Karl R. Ziegler0
John E. Gatehouse0
Fritz C. Grensing0
Bruce D. Schmeck0
Date of Patent
May 10, 2022
0
Patent Application Number
158876770
Date Filed
February 2, 2018
0
Patent Primary Examiner
‌
John A Hevey
0
CPC Code
‌
C22C 9/06
0
‌
C22C 9/02
0
‌
C22C 9/00
0
‌
C22F 1/08
0

Disclosed are various processes for preparing a strip or plate of a copper-nickel-tin alloy. The processes begin with an input, usually of a rectangular shape. The input is hot rolled and annealed. The input is then subjected to a first cold reduction, a first annealing a second cold reduction, a second annealing, a third cold reduction, and a third annealing. If desired, a fourth cold reduction, a fourth annealing, and a fifth cold reduction may be performed. The resulting strip or plate is very smooth and has increased fatigue life, along with high strength.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 11326242 Copper-nickel-tin alloys

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.