List of Indium Corporation patents

Patents where

Current Assignee

Name

Indium Corporation

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 11581239 Lead-free solder paste as thermal interface material	Patent 11581239 was granted and assigned to Indium Corporation on February, 2023 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11581239	February 14, 2023
‌ US Patent 11602808 Solder preform with internal flux core including thermochromic indicator	Patent 11602808 was granted and assigned to Indium Corporation on March, 2023 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11602808	March 14, 2023
‌ US Patent 11413709 High reliability lead-free solder alloys for harsh environment electronics applications		Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11413709	August 16, 2022
‌ US Patent 10943795 Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger	Patent 10943795 was granted and assigned to Indium Corporation on March, 2021 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	10943795	March 9, 2021
‌ US Patent 9636784 Mixed alloy solder paste	Patent 9636784 was granted and assigned to Indium Corporation on May, 2017 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	9636784	May 2, 2017
‌ US Patent 9010616 Low void solder joint for multiple reflow applications	Patent 9010616 was granted and assigned to Indium Corporation on April, 2015 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	9010616	April 21, 2015
‌ US Patent 11267080 Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders	Patent 11267080 was granted and assigned to Indium Corporation on March, 2022 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11267080	March 8, 2022
‌ US Patent 9468136 Low void solder joint for multiple reflow applications	Patent 9468136 was granted and assigned to Indium Corporation on October, 2016 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	9468136	October 11, 2016
‌ US Patent 8061578 Solder preform	Patent 8061578 was granted and assigned to Indium Corporation on November, 2011 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	8061578	November 22, 2011
‌ US Patent 8348139 Composite solder alloy preform	Patent 8348139 was granted and assigned to Indium Corporation on January, 2013 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	8348139	January 8, 2013
‌ US Patent 9120930 Heat dissipating paint with high thermal radiating capability	Patent 9120930 was granted and assigned to Indium Corporation on September, 2015 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	9120930	September 1, 2015
‌ US Patent 9175368 MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability	Patent 9175368 was granted and assigned to Indium Corporation on November, 2015 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	9175368	November 3, 2015
‌ US Patent 9017446 Mixed alloy solder paste	Patent 9017446 was granted and assigned to Indium Corporation on April, 2015 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	9017446	April 28, 2015
‌ US Patent 10943796 Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger	Patent 10943796 was granted and assigned to Indium Corporation on March, 2021 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	10943796	March 9, 2021
‌ US Patent 9260768 Lead-free solder alloys and solder joints thereof with improved drop impact resistance	Patent 9260768 was granted and assigned to Indium Corporation on February, 2016 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	9260768	February 16, 2016
‌ US Patent 9190377 Metal coating for indium bump bonding	Patent 9190377 was granted and assigned to Indium Corporation on November, 2015 by the United States Patent and Trademark Office.		Indium Corporation	United States Patent and Trademark Office	9190377	November 17, 2015
‌ US Patent 10888958 Hybrid high temperature lead-free solder preform	Patent 10888958 was granted and assigned to Indium Corporation on January, 2021 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	10888958	January 12, 2021
‌ US Patent 11229979 High reliability lead-free solder alloys for harsh environment electronics applications	Patent 11229979 was granted and assigned to Indium Corporation on January, 2022 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11229979	January 25, 2022
‌ US Patent 10537030 Voiding control using solid solder preforms embedded in solder paste	Patent 10537030 was granted and assigned to Indium Corporation on January, 2020 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	10537030	January 14, 2020
‌ US Patent 11712762 Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders		Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11712762	August 1, 2023
‌ US Patent 11766721 Thermally decomposing build plate for facile release of 3D printed objects	Patent 11766721 was granted and assigned to Indium Corporation on September, 2023 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11766721	September 26, 2023
‌ US Patent 12023735 Thermally decomposable build plate structure for stabilization of metal build surface during 3D printing and facile release of 3D printed objects	Patent 12023735 was granted and assigned to Indium Corporation on July, 2024 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	12023735	July 2, 2024
‌ US Patent 12090579 High reliability lead-free solder alloys for harsh environment electronics applications	Patent 12090579 was granted and assigned to Indium Corporation on September, 2024 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	12090579	September 17, 2024
‌ US Patent 11752579 High reliability leadfree solder alloys for harsh service conditions	Patent 11752579 was granted and assigned to Indium Corporation on September, 2023 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11752579	September 12, 2023
‌ US Patent 11999018 SnBi and SnIn solder alloys	Patent 11999018 was granted and assigned to Indium Corporation on June, 2024 by the United States Patent and Trademark Office.	Indium Corporation	Indium Corporation	United States Patent and Trademark Office	11999018	June 4, 2024

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