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US Patent 9997530 Three-dimensional semiconductor memory device and method of fabricating the same

Patent 9997530 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on June, 2018 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Current Assignee
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9997530
Date of Patent
June 12, 2018
Patent Application Number
14708477
Date Filed
May 11, 2015
Patent Citations Received
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US Patent 12136562 3D semiconductor device and structure with single-crystal layers
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US Patent 12094892 3D micro display device and structure
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US Patent 12120880 3D semiconductor device and structure with logic and memory
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US Patent 12125737 3D semiconductor device and structure with metal layers and memory cells
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US Patent 11711928 3D memory devices and structures with control circuits
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US Patent 11763864 3D memory semiconductor devices and structures with bit-line pillars
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US Patent 11784169 3D semiconductor device and structure with metal layers
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US Patent 11784082 3D semiconductor device and structure with bonding
...
Patent Primary Examiner
‌
Lex Malsawma
Patent abstract

A three-dimensional semiconductor memory device includes a peripheral circuit structure on a substrate, a horizontal active layer on the peripheral circuit structure, stacks provided on the horizontal active layer to include a plurality of electrodes, a vertical structure vertically penetrating the stacks, a common source region between ones of the stacks and in the horizontal active layer, and pick-up regions in the horizontal active layer. The horizontal active layer includes first, second, and third active semiconductor layers sequentially stacked on the peripheral circuit structure. The first and third active semiconductor layers are doped to have high and low impurity concentrations, respectively, and the second active semiconductor layer includes an impurity diffusion restraining material.

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