Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 12, 2018
Patent Application Number
14232396
Date Filed
July 13, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.
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