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US Patent 9818872 Multi-gate device and method of fabrication thereof

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Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9818872
Patent Inventor Names
Wai-Yi Lien0
Chih-Hao Wang0
Ching-Wei Tsai0
Kuo-Cheng Ching0
Ying-Keung Leung0
Carlos H. Diaz0
Date of Patent
November 14, 2017
Patent Application Number
14788161
Date Filed
June 30, 2015
Patent Citations Received
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US Patent 12132082 Channel mobility improvement
0
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US Patent 12068318 Method of forming epitaxial features
0
‌
US Patent 12074206 Integrated circuit device with improved reliability
0
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US Patent 12080603 Active region cut process
0
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US Patent 12078551 Complementary bipolar junction transistor
0
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US Patent 12087842 Inner spacer features for multi-gate transistors
0
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US Patent 12107169 Contact structure for stacked multi-gate device
0
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US Patent 12119392 Semiconductor device and method
0
...
Patent Primary Examiner
‌
Robert Huber
Patent abstract

A method of semiconductor device fabrication is described that includes forming a fin extending from a substrate and having a source/drain region and a channel region. The fin includes a first epitaxial layer having a first composition and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer having a second composition. The second epitaxial layer is removed from the source/drain region of the fin to form a gap. The gap is filled with a dielectric material. Another epitaxial material is formed on at least two surfaces of the first epitaxial layer to form a source/drain feature.

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