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US Patent 9555466 Substrate joining method using rivet, and joining structure

Patent 9555466 was granted and assigned to Nihon University on January, 2017 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
Nihon University
Nihon University
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
95554660
Patent Inventor Names
Kinya Watanabe0
Naoya Fujii0
Hiroyuki Hasegawa0
Masahito Ueda0
Date of Patent
January 31, 2017
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Patent Application Number
140022970
Date Filed
March 1, 2012
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Patent Citations Received
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US Patent 12110915 Clearance hole for self-piercing rivet
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Patent Primary Examiner
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Christopher M Koehler
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Patent abstract

A joining method includes punching respective laminated plate materials by a rivet shaft portion of a SPR, forming a crimp portion at the front end of the rivet shaft portion, and fastening and joining the laminated plate materials between the rivet head portion and the crimp portion. Washers are laid on and brought into contact with respective opposite surfaces relative to joining surfaces of the laminated plate materials, the washers each having an inner hole through which the rivet shaft portion is allowed to pass, the washers are used as jigs at the time of the punching, the punching by means of the rivet shaft portion is performed along the inner holes of the washers, and the joining is performed so that the washers left between the rivet head and the crimp portion and the opposite surfaces.

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