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US Patent 9502352 Semiconductor wiring patterns

Patent 9502352 was granted and assigned to LAPIS Semiconductor Co.,Ltd. on November, 2016 by the United States Patent and Trademark Office.

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Patent
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Patent attributes

Patent Applicant
LAPIS Semiconductor Co.,Ltd.
LAPIS Semiconductor Co.,Ltd.
Current Assignee
LAPIS Semiconductor Co.,Ltd.
LAPIS Semiconductor Co.,Ltd.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9502352
Date of Patent
November 22, 2016
Patent Application Number
14863756
Date Filed
September 24, 2015
Patent Primary Examiner
‌
Eduardo A Rodela
Patent abstract

A semiconductor device includes a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element includes, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate includes, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes.

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