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US Patent 9412817 Silicide regions in vertical gate all around (VGAA) devices and methods of forming same

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Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
94128170
Patent Inventor Names
Kai-Chieh Yang0
Wai-Yi Lien0
Date of Patent
August 9, 2016
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Patent Application Number
145776990
Date Filed
December 19, 2014
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Patent Citations Received
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US Patent 12132118 Semiconductor device having a multilayer source/drain region and methods of manufacture
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US Patent 12119391 Fin-based semiconductor device structure including self-aligned contacts and method for forming the same
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US Patent 12119404 Gate all around structure with additional silicon layer and method for forming the same
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US Patent 12125848 Semiconductor device structure incorporating air gap
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US Patent 12132092 Backside vias in semiconductor device
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US Patent 12132115 Semiconductor device structure with dielectric stressor
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US Patent 11658245 Semiconductor device and method of manufacturing
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US Patent 11664454 Method for forming semiconductor device structure
0
...
Patent Primary Examiner
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Anthony Ho
0
Patent abstract

An embodiment semiconductor device includes a nanowire extending upwards from a semiconductor substrate, a source/drain region in the nanowire, and a channel region in the nanowire over the source/drain region. The source/drain region further extends into the semiconductor substrate past edges of the nanowire. The semiconductor device further includes a gate structure encircling the channel region and a silicide in an upper portion of the source/drain region. A sidewall of the silicide is aligned with a sidewall of the gate structure.

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