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US Patent 9406521 Semiconductor device and method for fabricating the same

Patent 9406521 was granted and assigned to United Microelectronics Corporation on August, 2016 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Patent Applicant
Current Assignee
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9406521
Date of Patent
August 2, 2016
Patent Application Number
14793692
Date Filed
July 7, 2015
Patent Citations Received
‌
US Patent 12080603 Active region cut process
0
0
Patent Primary Examiner
‌
Benjamin Sandvik
Patent abstract

A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a plurality of fin shaped structures and an insulating layer. The substrate has a fin field-effect transistor (finFET) region, a first region, a second region and a third region. The first region, the second region and the third region have a first surface, a second surface, and a third surface, respectively, where the first surface is relatively higher than the second surface and the second surface is relatively higher than the third surface. The fin shaped structures are disposed on a surface of the fin field-effect transistor region. The insulating layer covers the first surface, the second surface and the third surface.

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