US Patent 9209142 Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal
Patent 9209142 was granted and assigned to Skorpios Technologies on December, 2015 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 5, 2014
0
Date of Patent
December 8, 2015
0
Patent Applicant
Patent Application Number
14562169
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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