US Patent 8735191 Method and system for template assisted wafer bonding using pedestals
Patent 8735191 was granted and assigned to Skorpios Technologies on May, 2014 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 3, 2013
Date of Patent
May 27, 2014
Patent Applicant
Patent Application Number
13733337
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 8735191 Method and system for template assisted wafer bonding using pedestals
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.