Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mark A. Harland0
Roger S. Kerr0
Timothy J. Tredwell0
Date of Patent
September 13, 2011
Patent Application Number
12694490
Date Filed
January 27, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 10. The metal substrate is removed from the master surface, and at least one electronic device is formed on the seed layer of the metal substrate.
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