Patent attributes
A micromachined sensor having a capacitive sensing structure. The sensor includes a first substrate with first and second conductive layers separated by a buried insulator layer, and a member defined by the first and second conductive layers and the buried insulator layer. A first set of elements defined with the first conductive layer is connected to the member and includes first and second elements that are electrically isolated from each other by the buried insulator layer. A second set of elements is defined with the first conductive layer and capacitively coupled with the first set of elements. A second substrate is bonded to the first substrate so that the member and the first set of elements are movably supported above the second substrate. The second set of elements is anchored to the second substrate, and the first and second sets of elements are physically interconnected through the second substrate.
