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US Patent 7754597 Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device

Patent 7754597 was granted and assigned to Seiko Epson on July, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A method for fabricating a bonding pad 45 includes disposing a droplet L including a liquid containing a conductive material on a substrate P by a droplet ejection method and solidifying the disposed droplet L to forms the pad. The bonding pad 45 formed has a cylindrical shape and includes a concave part 47.

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