Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tatsuya Ibaraki0
Hidefumi Fujita0
Hiroyuki Yamashina0
Date of Patent
November 17, 2009
0Patent Application Number
113406520
Date Filed
January 27, 2006
0Patent Primary Examiner
Patent abstract
A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 μm and an X value defined by equation (1) not greater than 0.5:X value=D50 (μm)/BET specific surface area (m2/g) (1)The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.
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