US Patent 7485361 Multilayered printed wiring board and manufacturing method thereof
Patent 7485361 was granted and assigned to Mitsui on February, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 9, 2004
Date of Patent
February 3, 2009
Patent Application Number
10580198
Patent Inventor Names
Tetsuro Sato
0
Kensuke Nakamura
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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