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US Patent 7436027 Semiconductor device and fabrication method for the same

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7436027
Date of Patent
October 14, 2008
Patent Application Number
11646274
Date Filed
December 28, 2006
Patent Citations Received
‌
US Patent 12136562 3D semiconductor device and structure with single-crystal layers
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US Patent 12094892 3D micro display device and structure
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US Patent 12120880 3D semiconductor device and structure with logic and memory
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US Patent 12125737 3D semiconductor device and structure with metal layers and memory cells
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US Patent 11694922 Multilevel semiconductor device and structure with oxide bonding
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US Patent 11694944 3D semiconductor device and structure with metal layers and a connective path
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US Patent 11711928 3D memory devices and structures with control circuits
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US Patent 11763864 3D memory semiconductor devices and structures with bit-line pillars
...
Patent Primary Examiner
‌
Zandra Smith
Patent abstract

In a semiconductor device including a monocrystalline thin film transistor 16a that has been formed on a monocrystalline Si wafer 100 and then is transferred to a insulating substrate 2, LOCOS oxidization is performed with respect to the element-isolation region of the monocrystalline Si wafer 100 so as to create a field oxide film (SiO2 film) 104, and a marker 107 is formed on the field oxide film 104. With this structure, alignment of components may be performed based on a gate electrode 106 upon or after the transfer step.

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