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US Patent 7211062 Solid solution perforator for drug delivery and other applications

Patent 7211062 was granted and assigned to THERAJECT, INC. on May, 2007 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
‌
THERAJECT, INC.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7211062
Date of Patent
May 1, 2007
Patent Application Number
10767359
Date Filed
January 28, 2004
Patent Citations Received
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US Patent 12127975 Devices and methods for adjusting the insertion depth of a needle for medicament delivery
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US Patent 12090088 Device for ocular access
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US Patent 12090295 Microprojection arrays with enhanced skin penetrating properties and methods thereof
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US Patent 12090294 Targeted drug delivery methods using a microneedle
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US Patent 11653939 Microprojection arrays with microprojections having large surface area profiles
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US Patent 11672964 Bioactive components conjugated to substrates of microneedle arrays
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US Patent 11684763 Multi-component bio-active drug delivery and controlled release to the skin by microneedle array devices
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US Patent 11712421 Self-actuating articles
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...
Patent Primary Examiner
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Catherine S. Williams
Patent abstract

A solid drug perforator (SSP) system and an associated drug reservoir are provided for delivering theraputic, prophylactic and/or cosmetic compounds, for nutrient delivery and for drug targeting. For drug delivery, the SSP system includes an active drug ingredient and a matrix of perforator material that biodegrades or dissolves quickly upon contact with a patient's body. The SSP system provides a skin barrier perforator and a controller for prompt initiation and cut-off of drug delivery. In a preferred method of transdermal drug delivery, an SSP system containing a selected drug penetrates into an epidermis or dermis, and the drug is promptly released from the (dissolving) SSP system perforator. An additional drug is optionally delivered from a patch reservoir through skin pores created by insertion of the perforator. Formulation and fabrication procedures for the SSP and associated reservoir are also provided. An SSP system can be fabricated with variety of shapes and dimensions.

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