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US Patent 6860802 Polishing pads for chemical mechanical planarization

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Date Filed
June 30, 2000
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Date of Patent
March 1, 2005
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Patent Application Number
09608537
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Patent Citations Received
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US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ
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US Patent 11883925 Polishing pad and method for manufacturing same
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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes
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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
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Patent Inventor Names
Peter A. Burke
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Arun Vishwanathan
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David B. James
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David Shidner
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Lee Melbourne Cook
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
6860802
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Patent Primary Examiner
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Timothy V. Eley
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