US Patent 12119404 Gate all around structure with additional silicon layer and method for forming the same
Patent 12119404 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 29, 2023
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Date of Patent
October 15, 2024
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Patent Applicant
Patent Application Number
18344057
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Patent Citations
•••
Patent Inventor Names
Chun-Hsiung Lin
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Chih-Hao Wang
0
Chen-Han Wang
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Pei-Hsun Wang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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