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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables

Patent 11986922 was granted and assigned to Applied Materials on May, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Applied Materials
Applied Materials
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Date Filed
December 31, 2019
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Date of Patent
May 21, 2024
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Patent Applicant
Applied Materials
Applied Materials
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Patent Application Number
16731492
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Patent Citations
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US Patent 6860793 Window portion with an adjusted rate of wear
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US Patent 6860802 Polishing pads for chemical mechanical planarization
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US Patent 6866807 High-precision modeling filament
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US Patent 6869350 Polishing pads and methods relating thereto
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US Patent 6875096 Chemical mechanical polishing pad having holes and or grooves
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US Patent 6875097 Fixed abrasive CMP pad with built-in additives
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US Patent 6896593 Microporous polishing pads
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US Patent 6896765 Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
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US Patent 6913517 Microporous polishing pads
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US Patent 6935931 Microporous polishing pads
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•••
Patent Inventor Names
Gregory E. Menk
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Daniel Redfield
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Mario Cornejo
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John Watkins
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Rajeev Bajaj
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Aniruddh Jagdish Khanna
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Jason G. Fung
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11986922
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Patent Primary Examiner
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Nicholas R Krasnow
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CPC Code
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B24B 37/22
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B33Y 10/00
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