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US Patent 11745927 One or more blister packages containing active material and methods of making and using same

Patent 11745927 was granted and assigned to CSP Technologies, Inc. on September, 2023 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
CSP Technologies, Inc.
Current Assignee
‌
CSP Technologies, Inc.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11745927
Patent Inventor Names
Craig Voellmicke
Date of Patent
September 5, 2023
Patent Application Number
17807161
Date Filed
June 16, 2022
Patent Citations
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US Patent 11396413 One or more blister packages containing active material and methods of making and using same
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US Patent 8142603 Active film adhered to flexible packages and method thereof
‌
US Patent 10010480 Absorbing layer for blister package, laminate comprising same, and blister package using said laminate
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US Patent 10828234 Method for producing blister packs for medicinal products and blister pack
Patent Primary Examiner
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Steven A. Reynolds
CPC Code
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B65D 81/266
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B65D 81/267
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A61J 1/035
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B65D 75/367

A blister pack having a backing having a first side and an opposing second side. Each of the first and second side is flat or planar. The blister pack can also include a cover having a first side and an opposing second side. At least a portion of the second side of the cover is adhered to the first side of the backing to form a sealed package for containing product. The cover can include at least one blister. The blister pack can also include an active member positioned within each blister. Each active member can be in the form of a ring with an opening extending therethrough or a depression formed therein.

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