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US Patent 11518078 Methods for dispensing and adhering hot melt entrained polymers to substrates

Patent 11518078 was granted and assigned to CSP Technologies, Inc. on December, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
CSP Technologies, Inc.
Current Assignee
‌
CSP Technologies, Inc.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11518078
Date of Patent
December 6, 2022
Patent Application Number
17012475
Date Filed
September 4, 2020
Patent Primary Examiner
‌
Jacob T Minskey
CPC Code
‌
B29C 48/865
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B29C 48/08
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B29C 48/2556
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B29C 48/266
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B29C 48/21
‌
B29C 48/1476
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B29C 48/0021
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B29C 65/02
...

Disclosed are an entrained polymer or an entrained polymer composition, and a method for forming and adhering an entrained polymer structure to a substrate using the entrained polymer or an entrained polymer composition. The method includes providing a substrate configured to receive application of a molten entrained polymer. A particulate entrained polymer in molten form is applied in a predetermined shape, to a surface of the substrate, to form a solidified entrained polymer structure on the substrate. The entrained polymer includes a monolithic material formed of at least a base polymer and a particulate active agent. The surface of the substrate is compatible with the molten entrained polymer so as to thermally bond with it. In this way, the entrained polymer bonds to the substrate and solidifies upon sufficient cooling of the entrained polymer.

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