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US Patent 11515674 Electrical connection assembly with high density of contacts

Patent 11515674 was granted and assigned to Safran Electronics & Defense on November, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
Safran
Safran
Current Assignee
‌
Safran Electronics & Defense
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11515674
Date of Patent
November 29, 2022
Patent Application Number
17765964
Date Filed
September 30, 2020
Patent Primary Examiner
‌
Truc T. Nguyen
CPC Code
‌
H01R 12/716
‌
H01R 12/724
‌
H01R 13/6585
‌
H01R 12/721
‌
H01R 12/737
‌
H01R 13/6581
‌
H01R 13/6594
‌
H01R 24/50
...

An electrical connection assembly including two complementary connectors, each including a mutually parallel electrically insulating plates each comprising one face carrying signal transport contacts and an opposite face carrying at least one shielding sheet in such a manner that, when the connectors are connected together, the plates are interleaved between one another so that the contacts are pressed against one another and the shielding sheets are pressed against each other.

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