Log in
Enquire now
‌

US Patent 11426916 Methods for dispensing and adhering hot melt entrained polymers to substrates

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
CSP Technologies, Inc.
Current Assignee
‌
CSP Technologies, Inc.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11426916
Date of Patent
August 30, 2022
Patent Application Number
16490773
Date Filed
March 5, 2018
Patent Primary Examiner
‌
Jacob T Minskey
CPC Code
‌
B29C 48/865
‌
B29C 48/08
‌
B29C 48/2556
‌
B29C 48/266
‌
B29C 48/21
‌
B29C 48/1476
‌
B29C 48/0021
‌
B29C 65/02
...

Disclosed are methods for forming and adhering an entrained polymer structure to a substrate. The methods include providing a substrate (

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 11426916 Methods for dispensing and adhering hot melt entrained polymers to substrates

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.