Log in
Enquire now
‌

US Patent 11424144 Conformal manufacturing device and method for complex curved-surface electronic system

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
April 9, 2018
0
Date of Patent
August 23, 2022
0
Patent Application Number
16340380
0
Patent Citations
‌
US Patent 10667403 Manufacturing apparatus for performing additive manufacturing of an electrical device
‌
US Patent 10569464 Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning
‌
US Patent 10155313 Discrete assemblers utilizing conventional motion systems
‌
US Patent 10462907 Printed three-dimensional (3D) functional part and method of making
‌
US Patent 10518490 Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices
Patent Inventor Names
Hao Wu
0
Jiankui Chen
0
Kun Bai
0
Wenlong Li
0
Yongan Huang
0
Zhouping Yin
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11424144
0
Patent Primary Examiner
‌
Atul P. Khare
0
CPC Code
‌
B33Y 30/00
0
‌
B33Y 40/00
0
‌
B33Y 50/00
0
‌
B33Y 50/02
0
‌
H05K 3/125
0
‌
H05K 3/207
0
‌
B29C 64/112
0
‌
B29C 64/194
0
‌
B29C 64/209
0
‌
B29C 64/245
0
•••

Find more entities like US Patent 11424144 Conformal manufacturing device and method for complex curved-surface electronic system

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.