US Patent 11413686 Methods and apparatuses for sealing mechanisms for realizing adhesive connections with additively manufactured components

A node may be additively manufactured. The node may include a first surface and a second surface, and the second surface may bound a recess of the node. A structure may be inserted into the recess. A sealing member extend away from the second surface and contact the structure, such that a sealed space may be created between the node and the structure. An adhesive may be applied in the sealed space to at least partially attach the structure to the node.