US Patent 11396413 One or more blister packages containing active material and methods of making and using same
Patent 11396413 was granted and assigned to CSP Technologies, Inc. on July, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 20, 2019
0
Date of Patent
July 26, 2022
0
Patent Applicant
Patent Application Number
17250887
0
Patent Citations Received
Patent Inventor Names
Craig Voellmicke
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
CPC Code
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