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US Patent 11337890 Packaging assembly and container for same, method of making a packaging assembly, and associated method of activating an active agent

Patent 11337890 was granted and assigned to CSP Technologies, Inc. on May, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
‌
CSP Technologies, Inc.
Date Filed
September 17, 2018
Date of Patent
May 24, 2022
Patent Application Number
16649080
Patent Citations
‌
US Patent 10828234 Method for producing blister packs for medicinal products and blister pack
0
Patent Citations Received
‌
US Patent 11857493 Blister pack for medicinal products and tool for producing the blister pack
0
Patent Inventor Names
Roland Brunsteiner
0
Wilhelm Zuser
0
Thomas Schwarz
0
Ralf Kibele
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11337890
Patent Primary Examiner
‌
Gloria R Weeks
CPC Code
‌
B65B 7/2878
‌
B65B 5/04
‌
B65B 7/28
‌
B65B 7/168

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