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US Patent 11331836 Methods of overmolding softer material with harder material and moisture tight container assemblies made by the methods

Patent 11331836 was granted and assigned to CSP Technologies, Inc. on May, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
CSP Technologies, Inc.
Current Assignee
‌
CSP Technologies, Inc.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11331836
Date of Patent
May 17, 2022
Patent Application Number
16499481
Date Filed
March 30, 2018
Patent Primary Examiner
‌
Robert J Hicks
CPC Code
‌
B65D 43/16
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B65D 47/0838
‌
B65D 53/02
‌
B65D 55/16
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B65D 1/023
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B29C 45/1676
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B29C 45/0001
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B29C 45/0046
...

A method of over-molding materials includes: providing a first material in a groove in a first portion of a mold such that only a single surface of the first material is exposed to a vacant portion of the mold; providing, via an injection molding process, a second material in a liquid form in the vacant portion of the mold adjacent to, and in engagement with, the first material; and allowing the second material to solidify and become directly coupled to the first material, thus forming a single component. The second material has one or both of a greater hardness when solidified than the first material and/or a higher melting temperature than the first material.

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