US Patent 11191164 Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board
Patent 11191164 was granted and assigned to Dai Nippon Printing on November, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 26, 2016
0
Date of Patent
November 30, 2021
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Patent Application Number
15764025
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Patent Inventor Names
Tetsushi Hosoda
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Ryohei Kasai
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Tadashi Furukawa
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Teppei Sotoda
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Ayako Furuse
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Ryo Furugen
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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