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US Patent 11191164 Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

Patent 11191164 was granted and assigned to Dai Nippon Printing on November, 2021 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Current Assignee

Dai Nippon Printing

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

111911640

Patent Inventor Names

Tetsushi Hosoda0

Ryohei Kasai0

Tadashi Furukawa0

Teppei Sotoda0

Ayako Furuse0

Ryo Furugen0

Date of Patent

November 30, 2021

Patent Application Number

157640250

Date Filed

September 26, 2016

Patent Primary Examiner

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Jacob T Minskey

Patent abstract

A mold includes a mold base material and a rugged structure located at a main surface of the mold base material. The rugged structure includes a plurality of linearly shaped projected portions for forming wiring, and a circularly shaped projected portion for forming a pad portion, in which a light-shielding layer is provided at a top portion flat surface of the circularly shaped projected portion for forming the pad portion.