Log in
Enquire now
‌

US Patent 10463293 Methods and apparatus for monitoring wound healing using impedance spectroscopy

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10463293
Date of Patent
November 5, 2019
Patent Application Number
15379220
Date Filed
December 14, 2016
Patent Citations Received
‌
US Patent 12132271 Device with disposable element
0
‌
US Patent 11854702 Connected body surface care module
0
‌
US Patent 11980475 Detection of tissue damage
0
‌
US Patent 11471094 Detection of tissue damage
‌
US Patent 11534077 Apparatus and methods for determining damaged tissue using sub epidermal moisture measurements
‌
US Patent 10898129 Strategic treatment of pressure ulcer using sub-epidermal moisture values
‌
US Patent 10950960 Device with disposable element
‌
US Patent 10959664 Measurement of susceptibility to diabetic foot ulcers
...
Patent Primary Examiner
‌
Patrick Fernandes
Patent abstract

Methods and apparatus for real-time, quantifiable monitoring of high-risk areas of biological tissue are described. The methods and apparatus use impedance spectroscopy to detect subtle changes in tissue health.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 10463293 Methods and apparatus for monitoring wound healing using impedance spectroscopy

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.