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US Patent 10242992 Semiconductor memory device

Patent 10242992 was granted and assigned to Toshiba Memory Corporation on March, 2019 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Toshiba Memory Corporation
Toshiba Memory Corporation
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Current Assignee
Toshiba Memory Corporation
Toshiba Memory Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102429920
Patent Inventor Names
Tatsuya Okamoto0
Ryota Suzuki0
Tatsuya Kato0
Fumitaka Arai0
Wataru Sakamoto0
Date of Patent
March 26, 2019
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Patent Application Number
152059540
Date Filed
July 8, 2016
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Patent Citations Received
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US Patent 12125849 Semiconductor device, semiconductor wafer, memory device, and electronic device
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US Patent 10879261 Semiconductor memory with stacked memory pillars
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US Patent 10910401 Semiconductor device and method of manufacturing the same
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US Patent 11335699 Semiconductor device and method of manufacturing the same
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US Patent 11785774 Semiconductor device and method of manufacturing the same
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US Patent 11974432 Semiconductor storage device and method for manufacturing semiconductor storage device
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Patent Primary Examiner
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Eric A. Ward
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Patent abstract

A semiconductor memory device includes two first electrode films, a first column and a second insulating film. The two first electrode films extend in a first direction and are separated from each other in a second direction. The first column is provided between the two first electrode films and has a plurality of first members and a plurality of insulating members. Each of the first members and each of the insulating members are arranged alternately in the first direction. One of the plurality of first members has a semiconductor pillar, a second electrode film and a first insulating film provided between the semiconductor pillar and the second electrode film. The semiconductor pillar, the first insulating film and the second electrode film are arranged in the second direction. The second insulating film is provided between the first column and one of the two first electrode films.

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