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US Patent 10178800 Support structure for electronics having fluid passageway for convective heat transfer

Patent 10178800 was granted and assigned to Honeywell on January, 2019 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Honeywell
Honeywell
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Current Assignee
Honeywell
Honeywell
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
101788000
Patent Inventor Names
Ravi Anekal Radhakrishnan0
Mathews Leslie Kuriakose0
Rajendra Prasad Vrukshavai0
Rakesh Hota0
Saravana Mahalingam0
Yathiraj Kasal0
Abhay Naik0
Date of Patent
January 8, 2019
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Patent Application Number
154744860
Date Filed
March 30, 2017
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Patent Citations Received
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US Patent 12115583 Systems and methods for adhesive-based part retention features in additively manufactured structures
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US Patent 11504912 Selective end effector modular attachment device
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US Patent 11433557 Buffer block apparatuses and supporting apparatuses
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US Patent 11441586 Apparatus for injecting fluids in node based connections
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US Patent 11449021 Systems and methods for high accuracy fixtureless assembly
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US Patent 11850804 Radiation-enabled retention features for fixtureless assembly of node-based structures
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US Patent 11865617 Methods and apparatuses for wide-spectrum consumption of output of atomization processes across multi-process and multi-scale additive manufacturing modalities
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US Patent 11885000 In situ thermal treatment for PBF systems
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...
Patent Primary Examiner
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Xanthia C Cunningham
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Patent abstract

A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

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