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US Patent 10156873 Information handling system having fluid manifold with embedded heat exchanger system

Patent 10156873 was granted and assigned to Dell on December, 2018 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Dell
Dell
Current Assignee
Dell
Dell
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10156873
Date of Patent
December 18, 2018
Patent Application Number
15016234
Date Filed
February 4, 2016
Patent Citations
‌
US Patent 10010013 Scalable rack-mount air-to-liquid heat exchanger
Patent Citations Received
‌
US Patent 12137536 Systems and methods for autonomously activable redundant cooling of a heat generating component
0
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US Patent 11924998 Hybrid immersion cooling system for rack-mounted electronic assemblies
0
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US Patent 12120846 Immersion cooling systems for electronic components
0
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US Patent 12133361 Rack-based management of leaks in liquid cooled information handling systems
0
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US Patent 11871546 Cooling system of electronic systems, in particular for data centre
0
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US Patent 11877428 Modular horizontal rack manifold for liquid cooling
0
Patent Primary Examiner
‌
Michael J. Brown
Patent abstract

A Rack Information Handling System (RIHS) has a liquid-to-liquid heat exchanger (LTLHE) that is received in a rear section of a rack and includes node-receiving supply port/s and return port/s. LTLHE includes a first liquid manifold extending between the node-receiving supply port/s and the node-receiving return port/s. LTLHE includes a second liquid manifold capable of being in sealed fluid connection to a supply conduit and a return conduit of a liquid cooling supply for fluid transfer of a second cooling liquid. LTLHE includes a transfer plate formed of thermally conductive material separating the first and second liquid manifolds for transferring heat from the first cooling liquid to the second cooling liquid. RIHS includes a node-receiving chassis configured to receive inserted liquid cooled nodes that sealingly engage for fluid transfer of the first liquid to LTLHE embedded in the rack for heat absorption and transfer by the second liquid.

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