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US Patent 10010480 Absorbing layer for blister package, laminate comprising same, and blister package using said laminate

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Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
100104800
Patent Inventor Names
Masayuki Hosoi0
Kazumi Arai0
Makoto Kato0
Midori Kato0
Date of Patent
July 3, 2018
0
Patent Application Number
153195570
Date Filed
June 18, 2015
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Patent Citations Received
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US Patent 11833107 Blister packages containing active material and methods of making and using same
0
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US Patent 10239680 Blister package containing the laminated sheet and container
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US Patent 11745927 One or more blister packages containing active material and methods of making and using same
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US Patent 11396413 One or more blister packages containing active material and methods of making and using same
Patent Primary Examiner
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Michael C Miggins
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Patent abstract

The purpose of the present invention is to provide an absorbent layer for blister packs, which imparts sufficient formability and is free from forming failure even if a pocket part is formed to a certain depth. An absorbent layer for blister packs, which sequentially comprises, in the following order, an outer skin layer, an intermediate layer containing an inorganic absorbent and a binder resin, and an inner skin layer containing 5-80% by mass of a metallocene polypropylene and 95-20% by mass of a non-metallocene polypropylene.

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