Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
September 29, 2015
Patent Application Number
14032696
Date Filed
September 20, 2013
Patent Primary Examiner
Patent abstract
Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.
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