Patent attributes
A light emitting diode (80) includes a first and a second semiconductor structures (30, 40), and an adhesive layer (34, 46) between the first and the second semiconductor structures. The first semiconductor structure includes a n-type AlGaInP cladding layer (13), a p-type AlGaInP cladding layer (17), an AlGaInP active layer (15) between the n-type and the p-type AlGaInP cladding layers, a transparent conducting layer (62) on the n-type AlGaInP cladding layer, a first electrical contact (82) on the transparent conducting layer, ohmic electrodes (21) ohmic contact the p-type AlGaInP cladding layer, and a reflecting layer (32) on an opposite side of the p-type AlGaInP cladding layer to the AlGaInP active layer. The second semiconductor structure includes a carrier substrate (42), an ohmic contact layer (44) on the carrier substrate, and a second electrical contact (74) on an opposite side of the carrier substrate to the ohmic contact layer.
