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US Patent 11554442 Additive manufacturing device and additive manufacturing method

Patent 11554442 was granted and assigned to IHI Corporation on January, 2023 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
IHI Corporation
IHI Corporation
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Date Filed
October 4, 2018
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Date of Patent
January 17, 2023
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Patent Applicant
IHI Corporation
IHI Corporation
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Patent Application Number
16652851
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Patent Inventor Names
Kenta Shionuma
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11554442
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Patent Primary Examiner
‌
Zhipeng Wang
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CPC Code
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B33Y 30/00
0
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B33Y 50/00
0
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B33Y 50/02
0
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B22F 12/90
0
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B22F 12/49
0
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B22F 12/55
0
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B22F 10/28
0
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B22F 10/362
0
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B23K 15/0033
0
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B22F 2999/00
0
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