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US Patent 11476276 Semiconductor device and method for fabricating the same

Patent 11476276 was granted and assigned to Macronix on October, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Macronix
Macronix
Current Assignee
Macronix
Macronix
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11476276
Date of Patent
October 18, 2022
Patent Application Number
17102563
Date Filed
November 24, 2020
Patent Citations
‌
US Patent 10490567 Semiconductor device and method of manufacturing the same
‌
US Patent 10566346 Vertical-type memory device
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US Patent 10910402 Three-dimensional and flash memory and manufacturing method thereof
‌
US Patent 11037947 Array of pillars located in a uniform pattern
‌
US Patent 10068917 Vertical memory devices and methods of manufacturing the same
‌
US Patent 10141326 Semiconductor memory device
‌
US Patent 10243000 3-dimensional non-volatile memory device and method of fabricating the same
‌
US Patent 10276583 Three-dimensional memory device containing composite word lines including a metal silicide and an elemental metal and method of making thereof
...
Patent Citations Received
‌
US Patent 11785869 Memory device and method of manufacturing the same
Patent Primary Examiner
‌
Mary A Wilczewski
CPC Code
‌
H01L 2029/7858
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H01L 21/823431
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H01L 21/823821
‌
H01L 21/845
‌
H01L 27/0886
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H01L 27/0924
‌
H01L 27/10826
‌
H01L 27/10879
...

A semiconductor device includes a stack and a plurality of memory strings. The stack is formed on a substrate, and the stack includes conductive layers and insulating layers alternately stacked. The memory strings penetrate the stack along a first direction. Each of the memory strings includes a first conductive pillar, a second conductive pillar, a channel layer and a memory structure. The first conductive pillar and the second conductive pillar extend along the first direction, respectively, and electrically isolated to each other. The channel layer extends along the first direction. The channel layer is disposed between the first conductive pillar and the second conductive pillar, and the channel layer is coupled to the first conductive pillar and the second conductive pillar. The memory structure surrounds the first conductive pillar, the second conductive pillar and the channel layer.

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