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US Patent 11415726 Anti-reflective film and manufacturing method thereof

Patent 11415726 was granted and assigned to LG Chem on August, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
LG Chem
LG Chem
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Current Assignee
LG Chem
LG Chem
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114157260
Patent Inventor Names
Boo Kyung Kim0
Heon Kim0
Jin Seok Byun0
Seok Hoon Jang0
Yeong Rae Chang0
Date of Patent
August 16, 2022
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Patent Application Number
168200370
Date Filed
March 16, 2020
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Patent Citations
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US Patent 10222510 Anti-reflective film
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US Patent 10234599 Anti-reflective film
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US Patent 10627548 Anti-reflective film and manufacturing method thereof
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US Patent 10605960 Antireflection film containing inorganic particles and manufacturing method thereof
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US Patent 10663623 Anti-reflective film
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US Patent 10768342 Antireflection film comprising a low refractive index layer and a hard coating layer
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US Patent 10802178 Anti-reflective film
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US Patent 10895667 Antireflection film
...
Patent Primary Examiner
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Hai Vo
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CPC Code
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C08J 7/042
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C08J 7/046
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C08J 7/044
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C08J 2435/02
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G02B 1/111
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G02B 1/14
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B32B 7/02
0
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B32B 27/08
0

Described herein is an anti-reflective film including: a hard coating layer; and a low-refractive layer containing a binder resin and hollow inorganic nanoparticles and solid inorganic nanoparticles dispersed in the binder resin. The hollow and solid inorganic particles are dispersed in the low-refractive layer such that the amount of the solid inorganic nanoparticles positioned close to an interface between the hard coating layer and the low-refractive layer is larger than that of the hollow inorganic nanoparticles. Also described is a manufacturing method of the anti-reflective film including: applying a resin composition containing a photopolymerizable compound or a (co)polymer thereof, a fluorine-containing compound including a photoreactive functional group, a photoinitiator, hollow inorganic nanoparticles, and solid inorganic nanoparticles on a hard coating layer, and drying the applied resin composition at a temperature of 35° C. to 100° C.; and photocuring the dried resin composition.

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