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US Patent 11408649 Thermal management systems

Patent 11408649 was granted and assigned to Booz Allen Hamilton on August, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Booz Allen Hamilton
Booz Allen Hamilton
Current Assignee
Booz Allen Hamilton
Booz Allen Hamilton
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11408649
Date of Patent
August 9, 2022
Patent Application Number
16666973
Date Filed
October 29, 2019
Patent Citations
‌
US Patent 11168925 Thermal management systems
Patent Citations Received
‌
US Patent 11835271 Thermal management systems
0
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US Patent 11761685 Open cycle thermal management system with a vapor pump device and recuperative heat exchanger
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US Patent 11801731 Thermal management systems
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US Patent 11644221 Open cycle thermal management system with a vapor pump device
0
Patent Primary Examiner
‌
Kun Kai Ma
CPC Code
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F25B 49/00
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F25B 45/00
‌
F25B 19/00
‌
F25B 2400/16
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F25B 2700/191
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F25B 41/31
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F25B 39/028

A thermal management system includes an open circuit refrigeration circuit that has a refrigerant fluid flow path, with the refrigerant fluid flow path including a receiver configured to store a refrigerant fluid, a first control device configured to receive refrigerant from the receiver, a liquid separator, and an evaporator configured to extract heat from a heat load that contacts the evaporator, with the evaporator coupled to the first control device and the liquid separator. The system includes a pump having an inlet and an outlet, with the outlet of the pump coupled to the liquid side outlet of the liquid separator and a second control device that is coupled to an exhaust line, that is coupled to the vapor side outlet of the liquid separator through the second control device. In operation, the evaporator in the open circuit refrigeration circuit would be coupled to a heat load.

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